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PDF of presentation at CHARA Science Meeting: https://www.chara.gsu.edu/files/2025Meeting/01_SCOTT.pdf 

Abstract of presentation: https://eas2025programme.kuoni-congress.info/pdf/presentation/the-new-mobile-telescope-at-the-chara-array 

Abstract: https://eas2025programme.kuoni-congress.info/pdf/presentation/the-chara-array-building-towards-the-michelson-array 

Abstract: https://baas.aas.org/pub/2025n2i302p27/release/1 

Oscillating heat pipes (OHPs) represent a promising advancement over traditional heat pipes, yet their operational boundaries, especially for long OHPs, remain insufficiently understood. This study investigates the impact of varying adiabatic length, channel diameter, and fill ratio on thermal performance, crucial for assessing their suitability for engineering applications like spacecraft thermal management. Three long OHPs, ranging from 451 mm to 770 mm in total length, were subjected to multiple performance tests, employing channel diameters of 1.1 mm and 1.9 mm, along with adiabatic lengths of 305 mm and 610 mm. The experimental setup involved mounting the OHPs onto a testbed, monitored by nine K-type thermocouples. The tests, conducted horizontally to eliminate gravity-assistance, revealed that thermal performance is significantly influenced by channel diameter, adiabatic length, and fill ratio. Notably, optimal performance was observed at a 50% fill ratio, while reductions in diameter hindered start-up at a 70% fill ratio and failed to start-up at 30% fill ratio. These findings highlight the limitations of long OHPs, which is crucial to determine the limits of their applicability and dimensional constraints. 

Abstract: https://horizons-olbin.sciencesconf.org/file/1181666 

The electronics packaging community strongly believes that Moore’s law will continue for another few years due to recent technological efforts to build heterogeneously integrated packages. Heterogeneous integration (HI) can be at the chip level (a single chip with multiple hotspots), in multi-chip modules, or in vertically stacked three-dimensional (3D) integrated circuits. Flux values have increased exponentially with a simultaneous reduction in chip size and a significant increase in performance, leading to increased heat dissipation. The electronics industry and the academic research community have examined various solutions to tackle skyrocketing thermal-management challenges. Embedded cooling eliminates most sequential conduction resistance from the chip to the ambient, unlike separable cold plates/ heat sinks. Although embedding the cooling solution onto an electronic chip results in a high heat transfer potential, technological risks and complexity are still associated with the implementation of these technologies and with uncertainty regarding which technologies will be adopted. This manuscript discusses recent advances in embedded cooling, fluid selection considerations, and conventional, immersion, and additive manufacturing-based embedded cooling technologies.