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PDF of presentation at CHARA Science Meeting: https://www.chara.gsu.edu/files/2025Meeting/01_SCOTT.pdf 

Abstract of presentation: https://eas2025programme.kuoni-congress.info/pdf/presentation/the-new-mobile-telescope-at-the-chara-array 

Abstract: https://eas2025programme.kuoni-congress.info/pdf/presentation/the-chara-array-building-towards-the-michelson-array 

Abstract: https://baas.aas.org/pub/2025n2i302p27/release/1 

Oscillating heat pipes (OHPs) represent a promising advancement over traditional heat pipes, yet their operational boundaries, especially for long OHPs, remain insufficiently understood. This study investigates the impact of varying adiabatic length, channel diameter, and fill ratio on thermal performance, crucial for assessing their suitability for engineering applications like spacecraft thermal management. Three long OHPs, ranging from 451 mm to 770 mm in total length, were subjected to multiple performance tests, employing channel diameters of 1.1 mm and 1.9 mm, along with adiabatic lengths of 305 mm and 610 mm. The experimental setup involved mounting the OHPs onto a testbed, monitored by nine K-type thermocouples. The tests, conducted horizontally to eliminate gravity-assistance, revealed that thermal performance is significantly influenced by channel diameter, adiabatic length, and fill ratio. Notably, optimal performance was observed at a 50% fill ratio, while reductions in diameter hindered start-up at a 70% fill ratio and failed to start-up at 30% fill ratio. These findings highlight the limitations of long OHPs, which is crucial to determine the limits of their applicability and dimensional constraints. 

Abstract: https://horizons-olbin.sciencesconf.org/file/1181666 

Abstract. Warming in high alpine regions is leading to an increase in glacier surface melt production, firn temperature, and firn liquid water content, altering regional hydrology and climate records contained in the ice. Here we use field observations and firn modeling to show that although the snowpack at Eclipse Icefield at 3000 m a.s.l. in the St. Elias Range, Yukon, Canada, remains largely dry, meltwater percolation is likely to increase with an increase in intense melt events associated with continued atmospheric warming. In particular, the development of year-round deep temperate firn at Eclipse Icefield is promoted by an increase in the number of individual melt events and in average melt event magnitude combined with warmer wintertime temperatures, rather than an earlier or prolonged melt season. Borehole temperatures indicate that from 2016 to 2023 there was a 1.67 °C warming of the firn at 14 m depth (to -3.37±0.01 °C in 2023). Results from the Community Firn Model show that warming of the firn below 10 m depth may continue over the next decade, with a 2 % chance of becoming temperate year-round at 15 m depth by 2033, even without continued atmospheric warming. Model results also show that the chance of Eclipse Icefield developing year-round temperate firn at 15 m depth by 2033 increases from 2 % with 0.1 °C atmospheric warming over the period 2023–2033 to 12 % with 0.2 °C warming, 51 % with 0.5 °C warming, and 98 % with 1 °C warming. As the majority of the St. Elias Range's glacierized terrain lies below Eclipse Icefield, the development of temperate firn at this elevation would likely indicate widespread meltwater percolation in this region and a wholesale change in its hydrological system, reducing its capacity to buffer runoff and severely limiting potential ice core sites. It is therefore urgent that a deep ice core be retrieved while the record is still intact. 

The electronics packaging community strongly believes that Moore’s law will continue for another few years due to recent technological efforts to build heterogeneously integrated packages. Heterogeneous integration (HI) can be at the chip level (a single chip with multiple hotspots), in multi-chip modules, or in vertically stacked three-dimensional (3D) integrated circuits. Flux values have increased exponentially with a simultaneous reduction in chip size and a significant increase in performance, leading to increased heat dissipation. The electronics industry and the academic research community have examined various solutions to tackle skyrocketing thermal-management challenges. Embedded cooling eliminates most sequential conduction resistance from the chip to the ambient, unlike separable cold plates/ heat sinks. Although embedding the cooling solution onto an electronic chip results in a high heat transfer potential, technological risks and complexity are still associated with the implementation of these technologies and with uncertainty regarding which technologies will be adopted. This manuscript discusses recent advances in embedded cooling, fluid selection considerations, and conventional, immersion, and additive manufacturing-based embedded cooling technologies.